
Fang Luo
· Empire Innovation Associate Professor & Director of the Spellman High Voltage Power Electronics Laboratory at Stony Brook UniversityVerifiedStony Brook University · Electrical and Computer Engineering
Active 1985–2026
About
Fang Luo is an Empire Innovation Associate Professor and the Director of the Spellman High Voltage Power Electronics Laboratory at Stony Brook University. His research focuses on Power Electronic Converters and Systems, Power Module Packaging, and EMI Modeling and Mitigation in Power Electronics Systems. His work involves developing advanced power electronic technologies, addressing issues related to electromagnetic interference, and improving the efficiency and reliability of power systems.
Research topics
- Computer Science
- Electrical engineering
- Engineering
- Physics
- Electronic engineering
- Materials science
- Engineering physics
- Algorithm
- Quantum mechanics
- Nanotechnology
Selected publications
IEEE Access · 2026-01-01
articleOpen accessThis paper presents a comprehensive review of Medium Voltage (MV) Wind Energy Conversion Systems (WECS) with the integration of Wide-bandgap (WBG) semiconductor devices. With the growing demand for high-power offshore wind applications and the limitations of conventional Si-based power electronics, WBG devices offer significant advantages, including higher efficiency, reduced filter size, improved dynamic response, and enhanced thermal performance. This review evaluates MV WECS from system architecture to turbine converter design, highlighting how MV WBG devices enable advanced electrical architectures such as DC collection systems and Solid-State Transformers (SSTs). Additionally, the impact of ripple currents on generator losses—particularly in superconducting generators—is investigated. Simulation-based comparisons of various converter topologies with silicon- (Si) and silicon-carbide- (SiC) based devices validate the improvements in power quality and efficiency enabled by WBG technology. The review addresses the current research gap in MV WBG applications for WECS and provides insights into future trends and design considerations for high-efficiency, high-power WECS.
Adaptive Hybrid Prediction-Correction With Trust-Region and Dynamic Line Search for AC/DC Load Flow
IEEE Transactions on Power Delivery · 2026-02-11
articleSenior authorHybrid AC/DC power systems are gaining importance due to the rising penetration of Distributed Energy Resources (DERs) and the widespread deployment of Voltage Source Converters (VSCs). Analyzing power flow in such systems remains challenging due to unbalanced operating conditions, strong nonlinearities, and strict operational limits. This paper presents an Adaptive Hybrid Prediction-Correction algorithm with Trust-Region and Dynamic Line Search (AHPC-TRDLS) for reliable and efficient load flow computation in large-scale hybrid systems. The framework couples a Newton-Raphson-based prediction stage with a Preconditioned Conjugate Gradient (PCG) correction, bounded adaptively by a trust-region radius. A dynamic line search mechanism is incorporated as a fallback whenever the PCG convergence stalls, ensuring numerical stability. Additional features include adaptive preconditioning, enforcement of voltage and reactive power limits, and the use of symmetrical components for unbalanced system modeling. The algorithm is implemented in MATLAB and evaluated on different hybrid AC/DC test systems of varying scales. Case studies confirm that the proposed approach offers improved convergence, robustness, and scalability under stressed, ill-conditioned, and unbalanced scenarios.
Journal of Alloys and Compounds · 2026-03-31
articleSSRN Electronic Journal · 2026-01-01
preprintOpen accessFormation of the Pattern of Al–Zn Dendrites Driven by Solid–Liquid Interfacial Energy
Langmuir · 2026-02-02
articleSolid–liquid interfacial energy critically governs microstructural evolution and the functional properties of materials during phase transition. Here, we quantitatively characterize the anisotropy of solid–liquid interfacial energy in an Al-30 wt % Zn hypoeutectic alloy using the improved equilibrium shape method, X-ray microcomputed tomography (CT), and digital image analysis. We obtained the two-dimensional (ε4) and three-dimensional (ξ1, ξ2) anisotropy parameters by fitting droplet shapes with Fourier series and cubic harmonics. The interfacial energy is largest along the ⟨100⟩ and ⟨110⟩ directions, while the interfacial stiffness is smallest along the same directions. The near equivalence of stiffness between the ⟨100⟩ and ⟨110⟩ directions suppresses stable tip selection, destabilizes the growth front, and promotes hyperbranched, seaweed-like morphologies. This study provides quantitative evidence linking interfacial anisotropy to dendrite pattern formation and offers mechanistic insight into the morphological instability of Al–Zn alloys.
IEEE Transactions on Electromagnetic Compatibility · 2025-06-18 · 1 citations
articleSenior authorWith the advent of wide-bandgap devices, power converters are achieving higher performance switching capabilities. As a result, manufacturers are increasingly focused on reducing the complexity of power converters and enhancing the production and assembly process by transitioning from modular to highly integrated designs, which are high-density bidirectional converters (HDBCs). As a result, near-field (NF) coupling is becoming a concern for stable operation in HDBCs. Optimization for the power loop and gate drive (GD) can be achieved through computational electromagnetics tools and circuit simulators, allowing for a detailed visualization of NF distributions. In addition, the GD impedance can be fine-tuned by optimizing the gate-source trace layout, while near-electric field coupling must be considered when implementing a shielding layer between the GD and high <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\text{d}\mathbf {v}/\text{d}\mathbf {t}$</tex-math></inline-formula> nodes. This work presents a workflow for GD and power loop NF coupling modeling and optimization in HDBCs, aimed at mitigating issues such as mistriggering of switching devices and electromagnetic interference concerns in low-voltage systems.
Offshore Horizons: HVDC Wind Farms-Exploring Techno-Economic Dimensions
IEEE Access · 2025-01-01 · 3 citations
articleOpen accessHigh Voltage Direct Current (HVDC) technology is a cornerstone of efficient Offshore Wind Farm (OWF) power transmission. This review examines the integration of HVDC technology in OWFs, considering collection and transmission aspects. The analysis is structured around four key dimensions: economic considerations, connection topologies, converter designs, and technical modeling. It begins with an in-depth economic analysis, evaluating cost-effectiveness, reliability, and market dynamics, focusing on investment, operational costs, and lifecycle expenses. Building on this foundation, the review explores various collection and transmission architectures, highlighting their technical and economical trade-offs, and evaluates power converter designs for efficiency, reliability, and offshore adaptability. Finally, advanced modeling and simulation techniques are reviewed to optimize system performance, enhance reliability, and balance computational efficiency. Throughout each of the four sections, economic and technical constraints are considered together. This helps to improve understanding of how systems can be designed in a way that meets the constraints of both fields and to enhance feasibility on both dimensions. These insights provide a holistic framework for sustainable and economically viable Offshore Wind Energy (OWE) integration.
IEEE Journal of Emerging and Selected Topics in Power Electronics · 2025-09-30 · 2 citations
articleThis paper proposed a co-design framework for high power high voltage wide bandgap (WBG) power module packaging that is generalized to reflect diverse design requirements across device technologies, packaging configurations, and voltage classes. Beyond the commonly addressed thermal, electrical, and mechanical multidisciplinary co-optimization, the proposed framework specially emphasizes considerations for medium/high voltage (MV/HV) designs, introduces the concept of Packaging and Assembly Process Development Kit (PA-PDK) and integrates “Design for Reliability (DfR)” in the development process for power module packaging. The effectiveness of the co-design framework is validated through case study with a 3.3 kV/200 A wire-bonded, low-inductance, silicon carbide (SiC) half-bridge module, which serves as a reference for the implementation of such co-design framework.
IEEE Transactions on Industry Applications · 2025-03-04 · 4 citations
articleSenior authorSilicon Carbide (SiC) MOSFETs and Schottky diodes in the TO-247 package are economical options for chopper (buck/boost) and half-bridge configurations, which are fundamental building blocks for various power converter topologies. However, the fast switching of SiC implies high <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\text{d}\boldsymbol{v}/\text{d}\boldsymbol{t}$</tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\text{d}\boldsymbol{i}/\text{d}\boldsymbol{t}$</tex-math></inline-formula>, imposing a constraint on the PCB portion of power loop inductance in minimizing voltage overshoot during the turn-OFF transient. Although the vertical PCB power loop layout effectively reduces the PCB loop inductance, it increases the PCB parasitic capacitance. Due to the considerable lead inductance of the TO-247 package, this PCB capacitance is paralleled to the device's output capacitance through the package lead inductance, altering the switching transient. This article analyzes the effect of PCB capacitance on turn-OFF switching transient and ringing in chopper and half-bridge configurations with SiC devices in the TO-247 package. Initially, small-signal models incorporating PCB capacitance are derived. Subsequently, these models are validated in the frequency domain, and the switching transients are compared through double pulse test (DPT) on two PCB prototypes with the same layout but different stack-ups, yielding different PCB capacitances. Further, a comparative study of the proposed models with direct parallel approximation of PCB and device output capacitance is presented. Finally, the proposed small-signal models are analyzed to establish criteria, in terms of TO-247 lead and PCB loop inductance, for minimizing the impact of PCB capacitance on switching transients.
2025-10-19 · 1 citations
articleSenior authorThe increasing demand for resilient and sustainable energy solutions has led to the advancement of microgrids, inte-grating batteries and renewables as distributed energy resources. Li-ion battery banks exhibit a key challenge in balancing the state of charge (SoC) among modules. This article presents the validation of a distributed adaptive control strategy on a smart microgrid testbed to mitigate SoC imbalances and optimize energy distribution. The 20kW testbed incorporates a 48V /500Ah Li-ion battery bank, six 2000F/48V supercapacitors, and three 6.8k W inverters, with centralized monitoring and control via LabViewand an NI cRIO controller. A cloud dashboard enables real-time data visualization and remote accessibility. The microgrid setup was developed and implemented in real-time, with successful open-loop testing of the batteries and acquisition of real-time operational data. In parallel, the proposed distributed adaptive control strategy was modeled and validated using the PLECS simulation platform, with simulation results confirming the controller's effectiveness. This work lays a strong foundation for future AI -driven energy management strategies and high-power microgrid applications.
Recent grants
CAREER:Semiconductor-Based EMI Mitigation Architecture for Future Power Electronics Systems
NSF · $445k · 2021–2024
CAREER:Semiconductor-Based EMI Mitigation Architecture for Future Power Electronics Systems
NSF · $500k · 2019–2021
Frequent coauthors
- 65 shared
Hong Ye
China Energy Engineering Corporation (China)
- 48 shared
Asif Imran Emon
Stony Brook University
- 44 shared
Zhao Yuan
- 38 shared
Balaji Narayanasamy
University of Arkansas at Fayetteville
- 35 shared
Abdul Basit Mirza
Stony Brook University
- 30 shared
Hongwu Peng
- 29 shared
Dushan Boroyevich
Virginia Tech
- 28 shared
Miao Zhu
Shanghai Jiao Tong University
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