About

Yogesh Joshi is a professor at the Robert H. Smith School of Business, with expertise in competitive marketing strategies, innovation, product and brand management. His research has been published in leading business journals such as Marketing Science, Management Science, the Journal of Marketing, and the Journal of Marketing Research. He teaches courses on innovation, product development, marketing analytics, and strategic marketing models across undergraduate, MS, MBA, and PhD programs. His research interests include strategic marketing decisions involving product differentiation, advertising, innovation diffusion, and social influence, with notable contributions analyzing signaling quality through advertising, consumer behavior in indulgent consumption, social tags for brand perception, product line strategies, and market entry timing in social influence contexts.

Research topics

• Computer Science
• Engineering
• Mechanical engineering
• Materials science
• Meteorology
• Physics
• Electrical engineering
• Aerospace engineering
• Environmental science
• Automotive engineering
• Computer Security
• Mechanics
• Composite material
• Thermodynamics
• Process engineering
• Real-time computing
• Simulation
• Computer network
• Geography
• Environmental engineering
• Embedded system
• Telecommunications

Selected publications

• Enhanced Thermal Management of Outer-Rotor Electric Motors Through Additively Manufactured Heat Exchangers With End-Winding Cooling

  2025-05-27

  article

  Effective cooling strategy is critical to achieve improved performance and efficiency in electric-drive vehicle motors. Among approaches, direct winding heat exchangers (DWHXs), positioned inside the motor component slots, have demonstrated superior potential for cooling compared to conventional methods such as forced convection air cooling and liquid jacket cooling. In this work, an in-slot heat exchanger (HEx) based on the DWHX concept is developed for an outer-rotor motor with a 100 kW peak and 55 kW continuous power output, and 50 $\mathrm{kW} / \mathrm{L}$ power density. Initial work developed a baseline additively manufactured aluminum oxide heat exchanger to cool concentrated stator windings in an 18 -slot, 16 -pole outer-rotor motor; however, it lacked performance in cooling stator endwindings. A new design was envisioned to address this issue. The present study introduces a novel in-slot HEx design, which also incorporates a cooling solution for end-windings at both sides of the motor. The thermal performance of this new design is assessed and compared with the baseline concept. The results from the new design indicate an over 50% reduction in thermal resistance and more than 30% reduction in hot-spot temperature. The new design reduces end-winding temperature while maintaining improved thermal uniformity across the winding. The increase in pressure drop in the new design adds only 0.013 W to the pumping power. Furthermore, the results indicate that a potting material used as an interface material - with a thermal conductivity of 3$4 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}$ - to attach these heat exchangers to motor components is found optimal to ensure effective thermal performance. The achieved performance is realized without altering critical electromagnetic parameters, facilitating seamless integration with the current motor design. These results underscore the potential of ceramic-based in-slot HExs in improving the thermal performance and efficiency of modern electric-drive vehicle motors, representing a substantial advancement in the development of high-power-density electric motors.

  PublisherDOI

• Three Decades of Thermal Management Research at DARPA

  Journal of Electronic Packaging · 2025-06-09 · 1 citations

  article1st authorCorresponding

  Abstract Since its founding in 1992, Microsystems Technology Office at DARPA has invested in transformative advances in the field of semiconductor devices. These devices, pervasive in all microsystems, are operated within an economic life, dependent on both the material life of the semiconductor and the mechanical life of the electronics package housing the devices. Thermal management solutions directly impact the performance and reliable operational lifetime of microsystems. Multiscale and multiphysics codesign of microsystems can maximize their performance and reliability. The various DARPA programs in the area of thermal management over three decades are summarized here, along with the demonstrated advancements in each program. Current efforts on 3D heterogeneous integration, multiscale modeling, and high power GaN power amplifiers are also discussed.

  PublisherDOI

• Modelling Transient Pressure and Temperature Signatures in Gasketed Outdoor Digital Displays

  2025-10-28

  articleSenior author

  Abstract Outdoor digital displays deployed in harsh environments must withstand wide-ranging stresses driven by internal heat generation and fluctuating ambient conditions. The transient internal and external thermal conditions in the environment of a deployed display cause internal pressure and temperature fluctuations (termed “heartbeats”). This paper presents a transient computational fluid dynamics/heat transfer (CFD/HT) framework for simulating these fluctuations of pressure and temperature in gasketed outdoor digital displays and electronics enclosures. Using a pressure-based solver with the k–ω SST turbulence model and ideal-gas density, a new leakage model (based on experimental decay curves) is used to represent air losses from gasket and seams by using pressure and temperature driven source terms. Variable electronic heat loads and fan PWM duty cycles are imposed through user-defined named expressions. The developed framework is validated against experimental data from a production testing protocol designed to determine the quality of a gasket seal in an outdoor digital display prior to deployment, while under controlled ambient conditions. The MRI BoldVu Gen15 55″ double-sided outdoor digital display was used for all experimental testing. The results reveal that gasket leakage dominates pressure decay during cooling, while the air thermal expansion drives the pressure increase during heating phase. This validated model offers insights into design optimization of enclosure sealing and thermal management strategies.

  PublisherDOI

• Comparative performance analysis of slot-embedded cooling of electric motors for various topologies

  Applied Thermal Engineering · 2025-02-04 · 5 citations

  article
  PublisherDOI

• CFD/HT Simulations and DNN Modelling of Conjugate Heat Transfer in Metal Foams

  2025-03-27

  book-chapterSenior author

  This chapter presents the application of machine learning/artificial intelligence (ML/AI) approaches for characterization of single-phase fluid flow and heat transfer characteristics of metal foams. Metal foams were scanned using high-resolution microcomputed tomography. The scanned images were numerically investigated using OpenFOAM for combined heat conduction and convection characteristics. The overall pressure drop and heat transfer results agreed well with experimental data and the empirical correlations in the literature. Longitudinal flow mixing across pores due to the blockage of nodes has been analyzed and depicted for different porosities. The temperature distribution, local heat transfer coefficient, and heat flux on the metal foam fluid interface are characterized to reveal the underlying physical reasons for different metal foams exhibiting distinct thermal characteristics. In addition, the variation of these parameters perpendicular to the heated surface has been examined for different velocities. The results showed higher local heat transfer coefficients for thinner filaments. However, the temperature difference between the fluid and solid portions is marginal due to the lower effective thermal conductivity for higher porosity (low-density) metal foams. The study also showed that the effective interfacial area used for heat transfer decreases with inlet velocity and porosity. The local heat transfer coefficients and local heat fluxes on the interface are analyzed in detail. The regions of strong heat transfer are reported. A comprehensive review of ML/AI approaches has been provided in thermal management and, in particular, metal foams. The integrated values from the computational fluid dynamics/heat transfer (CFD/HT) solutions were used to train a deep neural network (DNN) algorithm. Three-dimensional (3D) surface plots were generated to show the agreement of the numerical data and the predictions obtained by using the DNN algorithm. The computational time can be reduced from several hours to a few minutes by using the DNN model. This study can provide guidance in improved channel design and metal foam selection for high-performance heat exchangers.

  PublisherDOI

• Thermal Performance of Triply Periodic Minimal Surface Lattice Structures in Single-Phase Dielectric Fluid Cooling of Power Electronics

  ASME Journal of Heat and Mass Transfer · 2025-08-15

  articleOpen accessSenior author

  Abstract Additive manufacturing has transformed thermal management by enabling the production of complex, optimized geometries that conventional manufacturing methods cannot achieve. This study investigates the single-phase convective heat transfer performance of gyroid triply periodic minimal surface (TPMS) lattice structures with functional porosity. TPMS structures provide high surface area to volume ratios and are amenable to 3D printing. A gyroid numerical model was created and validated against an existing experimental study with a similar feature size to the investigated geometries. The TPMS structure has a periodic width of 1.6 mm, a length of 10 mm, and a height of 4 mm, with a functional porosity ranging from 0.5 to 0.8, decreasing with distance from the heated surface. Three different flow configurations were examined for an inlet fluid temperature of 70 °C. The inlet velocities range from 0.01 to 1.2 m/s, corresponding to a Reynolds number range of 10–900 with a heat flux of 50 W/cm2 applied at the base. AmpCool® AC-110 dielectric fluid (Prandtl number 59.5) was used as the coolant. Thermal performance and friction characteristics were studied for the three flow orientations. The parallel flow configuration was identified as the most efficient for heat removal. A detailed analysis of the numerical results highlights the underlying physics behind the thermal performance differences among the flow configurations.

  PublisherOA PDFDOI

• Thermal Performance of Liquid-Cooled Metal Foams Attached Using Different Thermal Interface Materials

  IEEE Transactions on Components Packaging and Manufacturing Technology · 2025-04-17

  articleSenior author
  PublisherDOI

• Wick assisted embedded evaporative cooling of motors

  OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2025-04-07

  otherOpen access1st authorCorresponding

  A cooling system for an electric motor that includes a stator having a plurality of slot windings and a rotor, coaxial with the stator, having a plurality of magnets, includes a coolant inlet to the motor and a coolant outlet from the motor. A coolant pathway is in fluid communication with the inlet and the outlet. Heat is transferable from the slot windings to the coolant pathway. A coolant flows through the coolant pathway and is in a liquid phase as it enters the coolant inlet, changing into a gaseous phase as heat is transferred to the coolant from the slot windings. A cooling loop is in fluid communication with the coolant inlet and the coolant outlet. The cooling loop cools the coolant so that substantially all of the coolant is in the liquid phase when it enters the coolant inlet.

  PublisherOA PDF

• Toward TSV-Compatible Microfluidic Cooling for 3D ICs

  IEEE Transactions on Components Packaging and Manufacturing Technology · 2024-12-12 · 12 citations

  article

  Cooling presents a significant challenge for high-performance 3-D integrated circuits (3D ICs). To this end, this research explores through-silicon via (TSV)-compatible micropin-fin heat sink (MPFHS) for high-power 3-D chip stacks. Copper TSVs with a diameter of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$5.2~\mu $ </tex-math></inline-formula>m and a high aspect ratio (HAR) of 29:1 are developed. An extensive experimental and computational investigation of the MPFHS under varying flow rates and power conditions was conducted, showing that the MPFHS maintains an average chip temperature below <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$72~^{\circ }$ </tex-math></inline-formula>C, even with a total power dissipation of 500 W and a power density of 312 W/cm2 at a flow rate of 117 mL/min. The minimum total thermal resistance achieved was <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$0.286~^{\circ }$ </tex-math></inline-formula>C<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\cdot $ </tex-math></inline-formula>cm2/W.

  PublisherDOI

• Decreased muscle to fat ratio is an independent predictor of severe hepatosteatosis: The quintessential body composition predisposing to MAFLD

  Clinical Nutrition ESPEN · 2024-09-19

  articleSenior author
  PublisherDOI

Frequent coauthors

• Andrei G. Fedorov

  Georgia Institute of Technology

  68 shared

• Muhannad S. Bakir

  Georgia Institute of Technology

  27 shared

• Avram Bar‐Cohen

  Intel (United States)

  26 shared

• Vaibhav K. Arghode

  Indian Institute of Technology Kanpur

  23 shared

• Dereje Agonafer

  The University of Texas at Arlington

  19 shared

• Emad Samadiani

  Google (United States)

  19 shared

• Wataru Nakayama

  19 shared

• Craig E. Green

  Georgia Institute of Technology

  18 shared